PCBs, or printed circuit boards, have revolutionised the electronic industry; however they lack the robustness of the earlier, steel-chassis, hardwired equipment, driving them to be much easier to crack. Restoring a circuit board needs a particular level of analytical ability, along with the skill to handle each element in the correct way.
Without having a thorough knowledge of the way a circuit board works, experts from Exception PCB express that diagnosing the trouble will be a problem. For PCBs that are especially complex, you might also need an oscilloscope to discover signals at different points, so as to discover the section which is creating the problem. Once this component has been discovered, it will then have to be replaced. Here, Exception PCB provides you with a brief guide on how to do this.
As outlined by Exception PCB, with the majority of passive (and occasionally active) components, a similar, as opposed to an exact copy of the broken element can be used as a replacement. You will find, for example, several unique versions of voltage regulators available, and one version can easily be swapped for another in a PCB. However, broken active components that have a very specific function (for example, audio amplifier chips) must be replaced with an exact copy.
After you have acquired the right replacement, you'll have to place the PCB on a flat surface for the fix. Exception flexible PCB says that you might use tape to stick the board on both sides to the surface, to ensure that it doesn't move whilst you are carrying out the replacement. Pull the damaged component off the board very delicately, using tweezers. Next, switch on your soldering iron and set it to about 400 degrees Celsius.
Take some copper wire and put it on the pads of the PCB where the component was, and use the soldering iron to heat it. Wonderful pcb that any surplus solder remaining on these pads could be absorbed by the copper. Get in line the leads of the replacement component with the board's pads, taking a look at to make sure that the element is aligned as it needs to be. Then, use the soldering iron and the solder to join the leads with the corresponding pads on the board.
2015年4月24日星期五
2015年4月15日星期三
PCB production process
One,contact the factory
First, the need to contact the PCBA manufacturer, and then registered customer number, then there will be people you quotation, place an order, and follow up the production schedule.
Two, expected to open
Objective: according to the engineering data MI requirements, in compliance with the requirements of the large plate, cut into small pieces production plate. The customer request small plate material requirements.
Process: plate material, edge cutting and grinding to a board to curium plate to beer fillet \according to requirements of MI
Three, drilling
Objective: according to the project information, in accord with the requirements of the opening sheet size, aperture drill position corresponding to the request.
Process: laminated plate pin, upper plate and lower plate, hole drilling, check \ repair
Four, the copper deposition
Objective: the copper deposition is the use of chemical methods in the insulation on the hole wall deposition of a thin layer of copper.
Process: coarse grinding, plate and hanging plate, copper precipitation automatic line, dipping down% dilute H2SO4, thickened copper
Five、 image transfer
Objective: to pattern transfer is the transfer of image from film to plate production
Process: (blue oil flow): grinding plate, printing the first side, drying, printing second surface, drying,exposure to flush the shadow to check; (dry film process): Ma plate to squeeze film, static,alignment and exposure to static, Chong shadow to check
Six, pattern plating
Objective: pattern plating is in line graphics bare copper skin or a hole on the wall of the plating layer of copper layer and the required thickness requirements to the thickness of the gold nickel or tin layer.
Process: on board, degreasing, water washing two times, etching, water washing, pickling, water washing, acid leaching, copper, tin, water washing, the lower plate
Seven, stripping
Objective: plating covered with NaOH solution receded anti film makes the non line copper layer is exposed.
Process: water film: inserting frames, alkali, washing and scrubbing, machine; dry film: board,machine
Eight, etching
Objective: etching is the use of chemical reaction to the copper layer corrosion non line parts.
Nine, the green
Objective: to transfer the green is green film graphics to the plate, to protect the line and stop line tin welding parts function
Process: grinding plate, printing photosensitive green to curium plate, exposure to Chong Ying;grinding plate, Indy side - drying plate to print second surface - drying plate
Ten, character
Objective: the character is an easy to recognize markers offers
Process: the green end curium, cooling static, adjusting net, seal character, curium
Eleven, gold finger
Objective: plating requires a layer thickness in the plug on the finger nickel \ gold layer, the wear resistance is more hardness
Process: on board, degreasing, water washing two times, etching, washed two times with water, acid pickling, water washing, copper plating, nickel plating, washing, gold-plated
Tin plate (a process parallel)
Objective: spray tin in the bare copper surface not covered on the solder oil spray a layer of tin,copper surface to protect non corrosion oxidation, so as to ensure the good welding performance.
Process: Micro etching, air drying, preheating, rosin, solder coated, hot air leveling coating, air cooling, washing drying
Twelve, forming
Objective: through mould pressing or milling machine gong out of shape forming method customer needs organic gongs, beer plate, hand gongs, hand cut
Note: Data gong machine plate and punching board and precise, hand gongs secondly, hand cut board lowest with can only do some simple shapes.
Thirteen, test
Objective: through 100% electronic testing, detecting visual is not easy to find to open circuit, short circuit etc. the influence of functional defects.
Process: the die, board, testing, qualified to FQC visual inspection, unqualified to repair, back testing, OK - REJ - Scrap
Fourteen, final inspection
Objective: through the appearance defects of 100% visual inspection panel, and the slight defect repair, avoid the problems and defects in plate out.
Specific work process: incoming to view the data, visual inspection, qualified, FQA checks, qualified,unqualified and packaging, processing, check OK
First, the need to contact the PCBA manufacturer, and then registered customer number, then there will be people you quotation, place an order, and follow up the production schedule.
Two, expected to open
Objective: according to the engineering data MI requirements, in compliance with the requirements of the large plate, cut into small pieces production plate. The customer request small plate material requirements.
Process: plate material, edge cutting and grinding to a board to curium plate to beer fillet \according to requirements of MI
Three, drilling
Objective: according to the project information, in accord with the requirements of the opening sheet size, aperture drill position corresponding to the request.
Process: laminated plate pin, upper plate and lower plate, hole drilling, check \ repair
Four, the copper deposition
Objective: the copper deposition is the use of chemical methods in the insulation on the hole wall deposition of a thin layer of copper.
Process: coarse grinding, plate and hanging plate, copper precipitation automatic line, dipping down% dilute H2SO4, thickened copper
Five、 image transfer
Objective: to pattern transfer is the transfer of image from film to plate production
Process: (blue oil flow): grinding plate, printing the first side, drying, printing second surface, drying,exposure to flush the shadow to check; (dry film process): Ma plate to squeeze film, static,alignment and exposure to static, Chong shadow to check
Six, pattern plating
Objective: pattern plating is in line graphics bare copper skin or a hole on the wall of the plating layer of copper layer and the required thickness requirements to the thickness of the gold nickel or tin layer.
Process: on board, degreasing, water washing two times, etching, water washing, pickling, water washing, acid leaching, copper, tin, water washing, the lower plate
Seven, stripping
Objective: plating covered with NaOH solution receded anti film makes the non line copper layer is exposed.
Process: water film: inserting frames, alkali, washing and scrubbing, machine; dry film: board,machine
Eight, etching
Objective: etching is the use of chemical reaction to the copper layer corrosion non line parts.
Nine, the green
Objective: to transfer the green is green film graphics to the plate, to protect the line and stop line tin welding parts function
Process: grinding plate, printing photosensitive green to curium plate, exposure to Chong Ying;grinding plate, Indy side - drying plate to print second surface - drying plate
Ten, character
Objective: the character is an easy to recognize markers offers
Process: the green end curium, cooling static, adjusting net, seal character, curium
Eleven, gold finger
Objective: plating requires a layer thickness in the plug on the finger nickel \ gold layer, the wear resistance is more hardness
Process: on board, degreasing, water washing two times, etching, washed two times with water, acid pickling, water washing, copper plating, nickel plating, washing, gold-plated
Tin plate (a process parallel)
Objective: spray tin in the bare copper surface not covered on the solder oil spray a layer of tin,copper surface to protect non corrosion oxidation, so as to ensure the good welding performance.
Process: Micro etching, air drying, preheating, rosin, solder coated, hot air leveling coating, air cooling, washing drying
Twelve, forming
Objective: through mould pressing or milling machine gong out of shape forming method customer needs organic gongs, beer plate, hand gongs, hand cut
Note: Data gong machine plate and punching board and precise, hand gongs secondly, hand cut board lowest with can only do some simple shapes.
Thirteen, test
Objective: through 100% electronic testing, detecting visual is not easy to find to open circuit, short circuit etc. the influence of functional defects.
Process: the die, board, testing, qualified to FQC visual inspection, unqualified to repair, back testing, OK - REJ - Scrap
Fourteen, final inspection
Objective: through the appearance defects of 100% visual inspection panel, and the slight defect repair, avoid the problems and defects in plate out.
Specific work process: incoming to view the data, visual inspection, qualified, FQA checks, qualified,unqualified and packaging, processing, check OK
2015年3月18日星期三
High PCB Design----Wonderful PCB (hk) Limited
In the field of telecommunications , the design is very complex , the transmission speed in the transmission of application data , voice and image of the
Has been far higher than 500Mbps, people in the communications field in pursuit of higher performance and faster to launch production
Goods, and the cost is not the first. They will use more board layers, sufficient power and ground planes, any problems that may arise in the high-speed signal lines will be implemented using discrete components match. They have
SI (signal integrity) and EMC (electromagnetic compatibility) experts to simulate and analyze the wiring before each
an internal design engineers follow strict design requirements. So the field of communication design engineers through
this design is often used excessive speed PCB design strategy.
Home computer motherboard design area is the other extreme, the cost and effectiveness above all , the design
Teachers are always using the fastest, the best , highest-performance CPU chips, memory and graphics processing module technology
To form increasingly complex computer . The home computer motherboards are usually four shelves , some high-speed PCB
Design technology is difficult to apply to this area , so engineers in the field of home computers generally have adopted over
Research methods to design high-speed PCB board, they are designed to fully study the specific circumstances of those who truly resolved
The existence of high-speed circuit problem.
Has been far higher than 500Mbps, people in the communications field in pursuit of higher performance and faster to launch production
Goods, and the cost is not the first. They will use more board layers, sufficient power and ground planes, any problems that may arise in the high-speed signal lines will be implemented using discrete components match. They have
SI (signal integrity) and EMC (electromagnetic compatibility) experts to simulate and analyze the wiring before each
an internal design engineers follow strict design requirements. So the field of communication design engineers through
this design is often used excessive speed PCB design strategy.
Home computer motherboard design area is the other extreme, the cost and effectiveness above all , the design
Teachers are always using the fastest, the best , highest-performance CPU chips, memory and graphics processing module technology
To form increasingly complex computer . The home computer motherboards are usually four shelves , some high-speed PCB
Design technology is difficult to apply to this area , so engineers in the field of home computers generally have adopted over
Research methods to design high-speed PCB board, they are designed to fully study the specific circumstances of those who truly resolved
The existence of high-speed circuit problem.
Repairing printed circuit boards - tips by Exception PCB
PCBs, or printed circuit boards, have revolutionised the electronic industry; however they lack the robustness of the earlier, steel-chassis, hardwired equipment, driving them to be much easier to crack. Restoring a circuit board needs a particular level of analytical ability, along with the skill to handle each element in the correct way.
Without having a thorough knowledge of the way a circuit board works, experts from Exception PCB express that diagnosing the trouble will be a problem. For PCBs that are especially complex, you might also need an oscilloscope to discover signals at different points, so as to discover the section which is creating the problem. Once this component has been discovered, it will then have to be replaced. Here, Exception PCB provides you with a brief guide on how to do this.
As outlined by Exception PCB, with the majority of passive (and occasionally active) components, a similar, as opposed to an exact copy of the broken element can be used as a replacement. You will find, for example, several unique versions of voltage regulators available, and one version can easily be swapped for another in a PCB. However, broken active components that have a very specific function (for example, audio amplifier chips) must be replaced with an exact copy.
After you have acquired the right replacement, you'll have to place the PCB on a flat surface for the fix. Exception PCB says that you might use tape to stick the board on both sides to the surface, to ensure that it doesn't move whilst you are carrying out the replacement. Pull the damaged component off the board very delicately, using tweezers. Next, switch on your soldering iron and set it to about 400 degrees Celsius.
Take some copper wire and put it on the pads of the PCB where the component was, and use the soldering iron to heat it. Wonderful pcb that any surplus solder remaining on these pads could be absorbed by the copper. Get in line the leads of the replacement component with the board's pads, taking a look at to make sure that the element is aligned as it needs to be. Then, use the soldering iron and the solder to join the leads with the corresponding pads on the board.
Without having a thorough knowledge of the way a circuit board works, experts from Exception PCB express that diagnosing the trouble will be a problem. For PCBs that are especially complex, you might also need an oscilloscope to discover signals at different points, so as to discover the section which is creating the problem. Once this component has been discovered, it will then have to be replaced. Here, Exception PCB provides you with a brief guide on how to do this.
As outlined by Exception PCB, with the majority of passive (and occasionally active) components, a similar, as opposed to an exact copy of the broken element can be used as a replacement. You will find, for example, several unique versions of voltage regulators available, and one version can easily be swapped for another in a PCB. However, broken active components that have a very specific function (for example, audio amplifier chips) must be replaced with an exact copy.
After you have acquired the right replacement, you'll have to place the PCB on a flat surface for the fix. Exception PCB says that you might use tape to stick the board on both sides to the surface, to ensure that it doesn't move whilst you are carrying out the replacement. Pull the damaged component off the board very delicately, using tweezers. Next, switch on your soldering iron and set it to about 400 degrees Celsius.
Take some copper wire and put it on the pads of the PCB where the component was, and use the soldering iron to heat it. Wonderful pcb that any surplus solder remaining on these pads could be absorbed by the copper. Get in line the leads of the replacement component with the board's pads, taking a look at to make sure that the element is aligned as it needs to be. Then, use the soldering iron and the solder to join the leads with the corresponding pads on the board.
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