Aluminum board process-C

5.9.2 precautions:
A.by board member of the board must pay attention to check, for no good grinding can take to mill again, for chafed can pick out those with sand paper (2000 #), sand flat after grinding plate.    
B. in a discontinuous production condition, must strengthen the maintenance, to ensure clean, tank cleaning.   
5.9.3 must be confirmed by the captain after Aluminum circuiy board surface has been handle, can only flow down.   
5.10 impact
5.10.1 edge with both hands, pay attention to the aluminum surface protection.    
5.10.2 aluminum plate forming die adopts high-grade beer board, and punching and shape a rushed or separate, impact, in accordance with the requirements of the MI must be placed after a piece of white paper on the surface of the aluminum plate.
5.10.3 impact should strengthen the inspection, pay attention to the don't fall green oil and chafed board face.   
5.10.4 no washing board at the time of the final inspection, the board, board with board between every good white skin.
5.10.5 every flush plate factory mold with a brush to clean again. 
5.11 final inspection: according to the IPC comprehensive enterprise standard and so on for each test.   

5.12 the packing  
5.12.1 different period, different packaging material number plate should be classification.    
5.12.2 when packing, please put moistureproof paper insulation and bead, and in the smallest package labels model indicating the version number, after the production cycle () a month for a cycle, etc.
6. About the final inspection chafed, oxidation of aluminum board's final inspection rework method caused by in the process of production of oxidation and flower aluminum plate, rework processing as follows.    
6.1 aluminum surface oxidation of aluminum plate: first line up the aluminum plate and emissions in the desktop, the cover line with welan and compaction, and then a few welan with double-sided adhesive, with a piece of light copper stick on it, the same to compaction, and then you can get a deburring machine on grinding plate.Note that before the grinding plate must turn off the pickling and put this section of the road wheel with tap water rinse clean to prevent pollution of acid tin, or directly from pickling after washing section into the aluminum base face up, only to open the above grinding brush, after grinding plate, such as oxidation phenomenon, can be ground again.Good grinding plate monolithic monolithic, put in grinding machine drying on the drying period, place 5 ~ 10 min, also can be put on the tray in white paper, take to the oven drying, 100 ℃ by 5 ~ 10 min, be careful not to take to forming washing machine to dry, because of its low temperature, it will bring aluminum surface oxidation.  

6.2 aluminum surface brush flower aluminum plate:
6.2.1 aluminum surface slightly brush flower aluminum plate, according to the aluminum surface oxidation 6.1 rework method.
6.2.2 aluminum face serious chafed aluminum board, first of all, use 2000 # sandpaper will wipe brush flat take place, and then use 4000 # sandpaper gently brush again, then 6.2.1 aluminum surface oxidation of aluminum plate rework method for processing.

Printed Circuit Board Words

01、基准尺寸：reference dimension
02、参考尺寸：reaerence dimension
03、直接量定尺寸：direct dimensioning
04、基准图：datum feature
05、基准边：reference edge
06、导线设计距离：design space of conductor
07、导线设计宽度：design width of conductor
08、中心距：center to center spacing
09、线宽/间距：conductor width/space
10、节距：pitch
11、精细节距：fine pitch
12、层：layer
13、层间距：layer-to-layer spacing
14、边距：edge spacing
15、外形线：trim line
16、截面积：crossection area
17、真实值表测量：truth table test
18、准确位置：true position tolerance
19、精确位置：accuracy
20、精确位置误差：cumulative tolerance
21、精确度：accuracy
22、累积误差：cumulative tolerance
23、焊垫：footprint
24、外层：external layer
25、内层：internal layer
26、接地层：ground plane
27、接地层隔离：ground plane clearance
28、电压层：voltage plane
29、电源层隔离：voltage plane clearance
30、电源层：power plane, bus plane
21、导通网络：basic grid
22、导通网格：track grid
23、导通孔网格：via grid
24、连通盘网格：pad (land) grid
25、定位偏差：positional tolerance
26、对准靶标：bornb sight
27、梳状图形：comb pattern
28、对准标记：register mark
29、散热层：heat sink plane
30、端接:termination
Sophie Deng
_______________________________________
Wonderful PCB Limited
NO.32A,Building NO.1, XianDaiC hengHuaTing,ChuangYeRoad|NanShan District,ShenZhen City 518054|  China  T +86-755-86229518-806 | F  +86 755 2607 3529|  e  wonderful08@wonderfulpcb.com |
w  www.wonderfulpcb.com  | Skype:wonderful-07   |                                                   
Welcome to our trading shows:
1.Booth: L32,Expo Electronic 2013,Apr.10-12th in CROCUS EXPO,Moscow,Russia
2.Booth: 11J36, HK Global sources  Apr.12-15th, 2013 Asia World-Expo, Hong Kong
3.Booth: 9J35, HK Global sources Oct.12-15th,2013 Asia World-Expo, Hong Kong
4.Booth: 70206, CES  2014  Jan,8th-11th in Las Vegas, USA

About PCB manufacturer

1.Drilling and electroplating
If production is a multilayer PCB, and containing buried hole or blind hole, each layer board must be bored with first plating before bonding. If you don't pass this step, then can't connect each other.
After by machine equipment according to the requirements of drilling borehole Kong Bi inside must go Through electroplating (Plated Through Hole technology, Plated - Through - Hole technology, PTH).After Kong Bi internal make metal processing, can make the internal lines of each layer can be connected to each other. Before starting the electroplating, must first clear hole of sundry. This is because the resin epoxy compound after heating will produce some chemical change, and it can cover internal PCB layer, so need to clear out. Remove and electroplating movements will be completed in the chemical process.

2. Multilayer PCB pressing
each single layer must be pressing to make sandwich plate. Pressing action including adding insulation between the layers, and fastened to each other. If there is through several layers of guide hole, then each layer must be repeated. A multilayer wiring on the outside of the two sides, is often only after a multilayer pressing processing.

3. Treatment resistance welding layer, surface screen printing and gold finger plating
Next resistance welding paint coverage on the outermost wiring, so the wiring will not come into contact with the outside plating parts. Screen printing surface is printed on it, to mark the location of the various parts, it will not be able to cover at any wiring or gold finger, otherwise may reduce solder ability or the stability of the current connection. Gold finger parts usually gold plating, which, when inserted into the expansion slot to ensure high quality of the current connection.

4. Test
to test whether there is a short circuit or open circuit PCB can use optical or electronic means testing. Optical methods using scanning to find out the defects of each layer, electronic testing is usually with fly needle detector (Flying Probe) to check all the connections. Electronic testing in search of short circuit or open circuit is precise, but the optical test cans more easily detected incorrect gaps between the conductors.

Aluminum PCB board Application

Led aluminum board thermal conductivity
Led aluminum pcb board and thermal conductivity aluminum board in the middle of the insulating layer (generally is PP, now has a thermal conductive adhesive, etc.), it is one of the three major measure of aluminum plate quality, heat resistance and pressure value is another two performance).Aluminum plate thermal conductivity can be tested after plate bonding instrument tests data, the high value of thermal conductivity is generally ceramic, copper, etc., but due to the cost into consideration, is currently on the market mainstream electronic aluminum plate, aluminum plate thermal conductivity of the corresponding is parameters of people's concern, the higher the coefficient of thermal conductivity is one of the symbols of the better performance.

Led aluminum plate classification
Led fluorescent lamp aluminum plate is aluminum plate classification, street light aluminum plate, tube light aluminum plate, wall lamp aluminum plate, shoot the aluminum plate, energy-saving light aluminum plate, electrodeless lamp aluminum plate, aluminum board, ceiling aluminum plate, wash wall lamp aluminum plate, the ball bubble lamp aluminum plate, tunnel light aluminum plate, floodlight, aluminum plate, aluminum plate, wall lamp high-power aluminum plate, small power aluminum plate, guardrail tube aluminum plate, neon lights aluminum plate, corn lamp aluminum plate, the candle light aluminum plate, absorb dome light aluminum plate, kitchen lamp aluminum plate, corridor lights aluminum plate, buried lights aluminum plate, dared light aluminum plate, industrial and mining lamp aluminum plate, aluminum plate bridge lights, floor tile lamp aluminum plate, stair light aluminum plate.

LED aluminum plate insulating layer
LED aluminum plate insulation layer is one of the most core technology of aluminum plate, the main adhesive, insulation and thermal conductivity of the function.Aluminum base board insulation is a power module.
Structure of the largest thermal barrier.Insulation heat conduction performance, the better, the more conducive to the spread of the heat produced during the operation, will be conducive to reduce the operating temperature of the device, so as to improve the module of power load, reducing the volume and prolong life, improve the power output, etc.
LED aluminum plate
1, audio equipment: input, output amplifier, balanced amplifier, audio amplifier, preamplifier, power amplifier, etc.   
2, power equipment, switching regulator ` DC/AC converter ` SW regulator, etc.   
3, communication electronic equipment: high frequency increase ` filtering electrical ` transmitting circuit.   
4, office automation equipment, motor drives, etc.    
5, automobile, electronic regulator ` igniter ` power controller, etc.   
6, a computer: CPU board ` diskette drive ` power supply device, etc.   
7, power module, inverter ` solid relay ` rectifier bridge, etc