Single side pcb
Single-Sided Boards we have just mentioned, at the most basic PCB, parts focused on one side, the wires are concentrated on the other side. Because the wire only in one side, so we call this PCB is called a single panel (Single-sided). Because there are many single panel strict limits on the design line (because only one side, and between the wiring alone can not cross * path must be around), so only the early use of such a circuit board only.
Double-sided pcb
Double-Sided Boards This board has wiring. However, to use the wire on both sides, must be between the two sides have the proper electrical connections for the job. This circuit between a "bridge" called pilot hole (via). The guide hole in the PCB, metal filled or coated with a hole, which can be connected to the wire on both sides. Because the double-sided single-panel area than twice as big, and because the wiring can be interleaved with each other (you can go around the other side), it is more suitable for use in more than one panel
Mulity layer PCB
[MLB] plywood when more complex application requirements, can be arranged in a Multilayer PCB structure and pressed together, and in the inter-layer connectivity provisioning through-hole circuit layers of circuitry. Inner line CCL first crop to fit the size of the production process. Before first use the substrate film usually requires brushing, micro-etching method such as a copper foil to make the appropriate plate surface roughening treatment, and then the appropriate temperature and pressure to the dry film resist is attached on the adhesion. After the polymerization reaction will produce a good dry film photoresist substrate paste into UV exposure machine, exposure, photoresist film by ultraviolet radiation transmittance in the region (the region will be dry later developed, copper etching step is retained as an etch resist), and the line image on the film over to the dry film photoresist on the board. Remove the protective film after the surface of the membrane, the first area of the membrane to the surface of the aqueous sodium carbonate developer removing unlit, mixed with hydrochloric acid and hydrogen peroxide solution out of the exposed copper is removed by etching to form a line. Finally, mission accomplished with aqueous sodium hydroxide wash dry film photoresist removed. For the six (or more) of the inner layer circuit board with automatic positioning punching machine out of the inter-layer circuit alignment riveting reference hole.
Sophie Deng
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